Die carrier

ABSTRACT

A die carrier is disclosed which is specifically designed for use in a TSOP socket. More specifically, the die carrier has a carrier substrate with carrier contacts thereon that are dimensioned specifically to match the positioning of the upper and lower socket contacts. The carrier substrate, being 145 microns thick, can also fit between the upper and lower socket contacts. A carrier base support component is located below a portion only of the carrier substrate, and does not impair insertion of the carrier substrate into the relatively small spacing between the upper and lower socket contacts. Damage to the carrier substrate is avoided by clamping edges of the carrier substrate from opposing sides between the upper and lower socket contacts. There are no screws or nuts within the carrier base support component that may increase its size and prevent it from being inserted into the socket.

CROSS-REFERENCE TO OTHER APPLICATIONS

This is a divisional of U.S. patent application Ser. No. 10/245,934,filed on Sep. 17, 2002, which issued as U.S. Pat. No. 6,859,057.

BACKGROUND OF THE INVENTION

1). Field of the Invention

This invention relates to a die carrier of the kind used for temporarilyholding a microelectronic die for purposes of burn-in and other testingof the die. The invention also relates to a microelectronic dieconnection assembly, including a socket which can be connected to acircuit board, and a die carrier that is designed for the socket.

2). Discussion of Related Art

Integrated circuits are usually manufactured in and on semiconductorwafers. Such a semiconductor wafer is subsequently cut into individualdice, each die carrying a respective integrated circuit. Cutting of awafer into individual dice is commonly referred to as “dicing” or“singulation”.

Once the individual dice are cut from the wafer, it is oftenadvantageous to test the integrated circuit in each die before thepackaging of the die. The added expense of packaging of the die can beavoided by first identifying defects in the die. Identification ofdefects is particularly important for multiple-die assemblies, where onedefective die can compromise the value of the entire assembly.

One way of testing a singulated unpackaged die is to temporarily insertthe die into a retaining formation in a carrier body of a die carrier. Aplurality of die contacts in the retaining formation make contact withrespective ones of a plurality of terminals on the die. External carriercontacts are electrically connected to the die contacts, and providesurfaces to which electric contact can be made for purposes of providingsignals between the carrier contacts and the terminals on the die.

The die carrier is then inserted into a socket. The socket has aplurality of electrically conductive pins which connects to a circuitboard. The socket also has a plurality of socket contacts that areelectrically connected to the pins and make contact with the carriercontacts. Electric current can thus conduct through the circuit boardthrough the circuit board connectors and the socket contacts to thecarrier contacts. An electric path is thereby established between thecircuit board and the unpackaged die, and can be used for testing theintegrated circuit in the die.

A few types of sockets exist that are used for testing thinsmall-outline package (TSOP) electronic assemblies. A TSOP is a packagehaving a microelectronic die that is inserted within a mold and having aplurality of 145 micron thin electric leads extending from opposingsides thereof. No die carrier has been designed for use within aTSOP-type socket.

SUMMARY OF THE INVENTION

According to one aspect of the invention, a microelectronic dieconnection assembly is provided. The connection assembly includes asocket and a die carrier. The socket includes a socket body, a pluralityof electrically conductive circuit board connectors, left andright-spaced rows of electrically conductive lower socket contacts, andleft and right-spaced rows of electrically conductive upper socketcontacts. The circuit board connectors are located externally on thesocket body. The lower and upper socket contacts are also on the socketbody, and at least some of the lower socket contacts and at least someof the upper socket contacts are electrically connected to at least someof the circuit board connectors. The upper socket contacts are actuableto move between retracted and contacting positions relative to the leftand right rows of lower socket contacts, respectively. The die carrierincludes a carrier body, a plurality of die contacts, and left and rightrows of carrier contacts. The carrier body has a retaining formation totemporarily and removably receive a microelectronic die. The diecontacts are located in the retaining formation to make contact withrespective ones of a plurality of terminals on the die. The carriercontacts are located on and extend from opposing sides of the carrierbody. The carrier contacts are electrically connected to the diecontacts. The rows of carrier contacts are at a select spacing relativeto one another, so as to be insertable between the left and right rowsof upper socket contacts when the upper socket contacts are in theirretracted position, and so that each carrier contact is located betweena respective pair of upper and lower socket contacts when the uppersocket contacts are in their contacting positions.

According to a further aspect of the invention, a die carrier isprovided, comprising a carrier support component, a carrier substrate, aplurality of die contacts, and a plurality of carrier contacts. Thecarrier support component has a first width. The carrier substrate islocated on the carrier support component, the carrier substrate having asecond width so that left and right portions of the carrier substrateextend beyond the carrier base support component. The carrier body islocated on the carrier substrate, the carrier body having a formation totemporarily and removably receive a microelectronic die. The diecontacts are located within the retaining formation on the carriersubstrate, to make contact with respective ones of a plurality ofterminals on the die. The carrier contacts are located on at least onesurface of each of the left and right portions of the carrier substrate,the carrier contacts being electrically connected to the die contacts.

According to a further aspect of the invention, a die carrier isprovided, comprising a carrier base, a carrier substrate, a carrierhinge base, a carrier body, a carrier hinge component, and a carrierhinge pin. The carrier substrate is located on the carrier basecomponent. The carrier hinge base is located on the carrier base. Thecarrier body is located on the substrate, and has a formation totemporarily and removably receive a microelectronic die. The carrierhinge pin is inserted through openings in the carrier hinge base and thecarrier body to secure the carrier body to the carrier hinge base, andthrough an opening in the carrier hinge component to secure the carrierhinge component pivotably to the carrier hinge base.

According to a further aspect of the invention, a die carrier isprovided, comprising a carrier substrate, a carrier body, a plurality ofdie contacts, and a plurality of lower carrier contacts. The carrierbody is located on the substrate, and has a retaining formation totemporarily and removably receive a microelectronic die. The diecontacts are located in the retaining formation on an upper side of thesubstrate to make contact with respective ones of a plurality ofterminals on the die. The lower carrier contacts are located on lowersides of left and right portions of the substrate, extending beyond thecarrier body, and are electrically connected to at least some of the diecontacts.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is further described by way of example with reference tothe accompanying drawings, wherein:

FIG. 1 is a perspective view of a die carrier according to an embodimentof the invention;

FIG. 1A is a cross-sectional side view illustrating the positioning of acompliant rubber membrane in the die carrier of FIG. 1;

FIG. 2 is top plan view illustrating die contacts, carrier contacts, andfan-out traces on an upper surface of a carrier substrate forming partof the die carrier of FIG. 1;

FIG. 3 is a partially cross-sectioned end view of a socket for which thedie carrier of FIG. 1 is designed;

FIG. 4 is a cross-sectional end view of a portion of the socketillustrating movement of upper socket contacts thereof into a retractedposition;

FIG. 5 is a block diagram illustrating testing of microelectronic diceaccording to the invention; and

FIG. 6 is a top plan view of a typical TSOP electronic device that canbe tested using the same equipment as in FIG. 3.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 of the accompanying drawings illustrates a die carrier 10according to an embodiment of the invention, which includes a carrierbase support component 12, a carrier substrate 14, four carrier hingebases 16A–D, a carrier body 18, a carrier cover 20, a carrier latch 22,front and rear carrier hinge pins 24A and 24B, and front and rearcarrier springs 26A and 26B.

The carrier hinge bases 16A–D are molded together with and thereforesecured to the carrier base support component 12. The carrier hingebases 16A and 16B are spaced from one another and extend upward from afront portion of the carrier base support component 12. The carrierhinge bases 16C and 16D are spaced from one another and extend upwardfrom a rear portion of the carrier base support component 12.

The carrier substrate 14 has a thickness of approximately 145 microns.In another embodiment, the carrier substrate 14 may be between 135 and155 microns thick. The carrier substrate 14 has four openings, each ofwhich is positioned over a respective one of the carrier hinge bases16A–D. As illustrated in FIG. 1A, a central portion of the carriersubstrate 14 rests partially on the carrier base support component 12and partially on a compliant rubber membrane 15A that seats in a pocket15B in a top surface of the carrier base support component 12. Thecarrier substrate 14 has a width W-1 which is more than a width W-2 ofthe carrier base support component 12, so that left and right portions36A and 30B of the carrier substrate 14 extend beyond the carrier basesupport component 12.

The carrier body 18 also has four openings, each of which is positionedover a respective one of the carrier hinge bases 16A–D. The carrierhinge bases 16A–D align the carrier body 18 with respect to the carriersubstrate 14. The carrier body 18 has a retaining formation 32 formedtherein. Sides of the retaining formation 32 are formed by respectiveportions of the carrier body 18, and a base of the formation 32 isformed by the carrier substrate 14.

The carrier cover 20 includes a cover hinge component 34 and a coverpressure plate 36. The cover pressure plate 36 is secured to the coverhinge component 34 in a manner that allows for pivoting or rocking ofthe cover pressure plate 36 relative to a cover hinge component 34, andfor the cover pressure plate 36 to be depressed toward the cover hingecomponent 34. A compression spring (not shown) between the cover hingecomponent 34 and cover pressure plate 36 biases the cover pressure plate36 away from the cover hinge component 34.

The cover hinge component 34 has two end components 38 that arepositioned over the carrier hinge bases 16 C and 16D. The rear carriertorsion spring 26B is inserted between the carrier hinge bases 16C and16D.

The carrier latch 22 has two end portions 40 that are positioned overthe carrier hinge bases 16A and 16B. The front carrier torsion spring26A is inserted between the carrier hinge bases 16A and 16B.

The front carrier hinge pin 24A is inserted through openings in portionsof the carrier body 18, the end portions 40 of the carrier latch 22, thecarrier hinge bases 16A and 16B, and through the front carrier torsionspring 26A. The front carrier hinge pin 24A so secures a front portionof the carrier body 18 through the carrier hinge bases 16A and 16B tothe carrier base support component 12 without the need for anyadditional space-consuming screws or nuts, and simultaneously securesthe carrier latch 22 pivotably to the carrier body 18.

Similarly, the rear carrier hinge pin 24B is inserted through openingsin portions of the carrier body 18, the end portions 38 of the coverhinge component 34, the carrier hinge bases 16C and 16D, and through therear carrier torsion spring 26B. The rear carrier hinge pin 24B sosecures a rear portion of the carrier body 18 through the carrier hingebases 16C and 16D to the carrier base support component 12, andsimultaneously secures the cover hinge component 34 pivotably to thecarrier body 18.

In use, a microelectronic die (not shown) is inserted into the retainingformation 32 with terminals of the microelectronic die located on thecarrier substrate 14. This orientation of the die is termed “flip chip”in the electronic industry. A vacuum is applied through suction holes 41in the carrier substrate 14 and carrier base support component 12 tohold the die down.

The carrier cover 20 is then pivoted about the rear carrier hinge pin24B and against a spring force created by the rear carrier spring 26B,so that the cover pressure plate 36 comes into contact with an uppersurface of the microelectronic die (back side of die in flip chiporientation). Pivoting of the cover pressure plate 36 relative to thecover hinge component 34 allows for leveling of a surface of the coverpressure plate 36 on the upper surface of the microelectronic die. Whenpressure is applied to an external surface of the cover hinge component34, a force is created by the spring between the cover pressure plate 36and the cover hinge component 34, which biases the microelectronic dieagainst the carrier substrate 14.

A tip 42 of the cover hinge component 34 moves an engaging formation 44of the carrier latch 22 against a spring force created by the frontcarrier spring 26A. The engaging formation 44 subsequently “snaps” overthe tip 42 and retains the carrier cover 20 in a closed position. Themicroelectronic die is then held within the retaining formation 32.

As illustrated in FIG. 2, the nonconductive carrier substrate 14 has anumber of conductive features formed thereon and therein; including aplurality of die contacts 50, a plurality of carrier contacts 52, and aplurality of fan-out traces 54. The die contacts 50 are located in acentral region of the carrier substrate 14. The die contacts 50correspond to the layout of the terminals on the microelectronic die, sothat each terminal on the microelectronic die makes contact with arespective one of the die contacts 50. The carrier base component 12 andthe pocketed compliant rubber membrane 15A provide opposing support forthe carrier substrate 14. The rubber membrane 15A, due to itscompliancy, allows for vertical movement of the die contacts relative tothe carrier base support component 12 and ensures proper contact betweeneach one of the die contacts 50 on the carrier substrate 14 with eachone of the terminals on the die. In another embodiment, compliance maybe provided by the carrier substrate 14, the die contacts 50, or theterminals on the die.

The carrier contacts 52 are located in left and right rows 52A and 52Brespectively on edges of the left and right portions 30A and 30B of thecarrier substrate 14. Each one of the carrier contacts 52A or 52B isconnected through a respective fan-out trace 54 to a respective one ofthe die contacts 50. More carrier contacts (not shown) are formed on alower surface of the carrier substrate 14. The carrier contacts on thelower surface of the carrier substrate 14 have a layout that correspondsto the layout of the carrier contacts 52A and 52B on the upper surfaceof the carrier substrate 14. A respective via 56 within the carriersubstrate 14 interconnects a respective one of the carrier contacts 52Aor 52B with a respective one of the carrier contacts on the lowersurface of the carrier substrate 14. Each carrier contact on the lowersurface of the carrier substrate 14 is thus also electrically connectedthrough a respective via 56 and fan-out trace 54 to a respective one ofthe die contacts 50.

In the particular embodiment, there are 27 of the carrier contacts 52Aand 27 of the carrier contacts 52B. In another embodiment, there may bebetween 22 and 35 carrier contacts in a particular row. One otherembodiment has 33 carrier contacts on a particular side. In theparticular embodiment, the carrier substrate 14 has a width ofapproximately 12 mm and a length of approximately 21 mm. In anotherembodiment, the width may be between 9 and 13 mm, and the length may bebetween 18 and 24 mm.

The die carrier 10 is first inserted into a test contactor for purposesof performing a pre-burn-in test on the die. The test contactor isdesigned to accommodate a typical TSOP electronic assembly, and the diecarrier 10, its shape, dimensions, and contact layout are designed tofit into and cooperate with the test contactor, with the carriercontacts on the lower surface of the carrier substrate 14 making contactwith corresponding contacts of the test contactor. The die carrier 10with the die is removed from the test contactor upon completion of thepre-burn-in test, and inserted into a typical TSOP burn-in socket forpurposes of carrying out a burn-in test.

FIGS. 3 and 4 illustrate a typical TSOP burn-in socket 60 for which thedie carrier 10 of FIG. 1 is designed. The left half of FIG. 3illustrates external components of the socket 60, and the right halfillustrates internal components in cross-section. A cross-sectionthrough the left half would mirror of the cross-section of the righthalf shown in FIG. 3.

The socket 60 includes a socket body 62, circuit board connector pins64, left and right rows (only the right row shown) of electricallyconductive lower socket contacts 66, left and right rows (only the rightrow shown) of electrically conductive upper socket contacts 68, and asocket actuator component 70.

The circuit board connector pins 64 are secured and extend from a lowersurface of the socket body 62. The circuit board connector pins 64 areinserted into corresponding holes in a circuit board of a burn-in board(not shown). More pockets are connected in a similar manner to thecircuit board. Electric current can be provided from the circuit boardthrough the circuit board connector pins 64 to the lower socket contacts66 and the upper socket contacts 68. A plurality of sockets such as thesockets 60 are usually connected to one circuit board and form apermanent or semi-permanent assembly.

A plurality of common junctions 72 are secured within the socket body 62and are electrically insulated from one another. Each circuit boardconnector pin 64 is electrically connected to a respective one of thecommon junctions 72.

Each lower socket contact 66 is electrically connected to a respectivecommon junction 72, and is at the location wherein an upper surface ofthe respective lower socket contact 66 is exposed. Each upper socketcontact is connected through a respective clamping spring 74 to arespective common junction 72. Each upper socket contact 68 is movablebetween a contacting position as shown in FIG. 3 and a retractedposition as shown in FIG. 4. In the contacting position, the respectiveupper socket contact 68 can move into contact with the upper surface arespective lower socket contact 66. The respective lower and uppersocket contacts 66 and 68 referred to are both connected to a respectivecommon junction 72, and are thus at the same voltage as the respectivecommon junction 72. In the retracted position, as shown in FIG. 4, theclamping spring 74 is bent so that the respective upper socket contact68 moves upward and to the right of the respective lower socket contact66.

The socket actuator component 70 is secured to the socket body 62 formovement between a raised position illustrated in FIG. 3 and a loweredposition illustrated in FIG. 4. A respective link component 76 issecured to each respective upper socket contact 68 and slides along asurface 78 of the socket actuator component 70, such that a tip of thelink component 76 moves to the right when the socket actuator component70 is lowered. Movement of the link component 76 to the right permitsthe upper socket contact 68 to move upward and to the right of the lowersocket contact 66.

All the upper socket contacts 68 in a particular row move in unisonupward and to the right. The upper socket contacts in the left half ofthe socket 60 simultaneously move in unison upward and to the left. Aspacing between the left and right rows of upper socket contacts 68 thusincreases when the socket actuator component 70 is lowered. This spacingagain decreases when the socket actuator component is raised under therestoring force of a socket spring 80 between the socket body 62 and thesocket actuator component 70.

In use, the upper socket contacts 68 are moved into the retractedposition shown in FIG. 4. The die carrier 10 of FIG. 1 with themicroelectronic die held therein is then inserted into the socket 60.The left and right rows of carrier contacts 52 on the lower surface ofthe carrier substrate 14 are positioned on top of the left and rightrows of lower socket contacts 66. The upper socket contacts 68 are thenmoved into the position shown in FIG. 3, with the carrier substrate 14clamped between the upper and lower socket contacts 68 and 66. Each oneof the upper socket contacts 68 on the right in FIG. 3 makes contactwith a respective one of the carrier contacts 52B in the row on theright in FIG. 2. Similarly, each one of the upper socket contacts in theleft of the socket 60 of FIG. 3 makes contact with a respective one ofthe carrier contacts 52A in the row on the left in FIG. 2. The pitchbetween the carrier contacts 52B in the row on the right thuscorresponds to the pitch between the upper socket contacts 68.Furthermore, the spacing between the left and right rows of carriercontacts 52A and 52B is designed to correspond to the spacing betweenthe left and right rows of upper socket contacts 68. Current can nowconduct through respective circuit board connector pins 64, commonjunction 72, a respective pair of upper and lower socket contacts 68 and66, a respective pair of carrier contacts 52 on upper and lower surfaces(only 52 on the upper surface shown) of the carrier substrate 14, arespective fan-out trace 54, and a respective die contact 50, to or froma respective terminal on the microelectronic die.

What should generally be noted is that the die carrier 10 of FIG. 1 isspecifically designed to be used within the socket 60. Morespecifically, the die carrier 10 has a substrate 14 with carriercontacts 52 thereon that are dimensioned specifically to match thepositioning of the upper and lower socket contacts 68 and 66. Thecarrier substrate 14, being 145 microns thick, can also fit between theupper and lower socket contacts 68 and 66. The carrier base supportcomponent 12, being located below only a portion of the carriersubstrate 14, does not impair insertion of the carrier substrate 14 intothe relatively small spacing between the upper and lower socket contacts68 and 66. Damage to the carrier substrate 14 is avoided by clampingedges of the carrier substrate 14 from opposing sides between the upperand lower socket contacts 68 and 66. What should also be noted is thatthere are no screws or nuts within the carrier base support component 12that may increase its size and prevent it from being inserted into thesocket 60. What should further be noted is that a double-sided, robustelectrical connection is made by each respective pair of upper and lowersocket contacts 68 and 66.

The die carrier 10, in combination with the socket 60, provides amicroelectronic die connection assembly that allows for signals to betransmitted between the circuit board and the microelectronic die forpurposes of testing the microelectronic die. Once burn-in testing iscompleted, the die carrier 10 is removed from the socket.

FIG. 5 illustrates the entire process for testing and packaging the die.The die is first loaded into the die carrier 10, as hereinbeforedescribed with reference to FIG. 1 (Step 102). The die carrier 10 isthen loaded into the test contactor for purposes of carrying out thepre-burn-in test (Step 104). The die carrier 10 is then removed from thetest contactor and inserted into the burn-in socket 60 as hereinbeforedescribed with reference to FIG. 3, for purposes of carrying out theburn-in testing (Step 106). More die carriers, each holding a respectivedie, are inserted into similar sockets on a burn-in board, and theburn-in board is then inserted into a burn-in oven where the burn-intesting is carried out. Following pre-burn-in testing, the burn-in boardis removed from the burn-in oven, and the die carrier 10 is removed fromthe burn-in socket 60 and again inserted into the test contactor forpurposes of carrying out parametric testing on the die (Step 108). Thedie carrier 10 is then removed from the test contactor and the die isthen removed from the die carrier following the reverse of the processdescribed with reference to FIG. 1 (Step 110). The die is then packagedin a conventional TSOP (Step 112), or is available to ship to a customeras a fully tested and burned-in bare die. The packaged die is then againloaded into the test contactor (Step 114). The layout of the contacts onthe TSOP are the same as the layout of the contacts on the die carrier10, so that the same test contactor can be used for purposes of testingthe packaged die in Step 114 as for testing the die at Steps 104 and108. Once final testing of the packaged die is completed, the packageddie is removed from the test contactor. The packaged die can then beshipped to a customer (Step 116).

FIG. 6 illustrates a TSOP electronic device 130 of the kind tested inStep 114. The TSOP electronic device 130 includes a microelectronic die132, permanently encapsulated with a material 134, and a plurality ofleads 136 extending from the material 136. The positioning of the leads136 is the same as the carrier contacts 52 in FIG. 2, which allows forthe device 130 to be tested in the test contactor at Step 114. The sametest contactor and the same socket 60 may be used to test other TSOPelectronic devices that are identical to the device 130.

While certain exemplary embodiments have been described and shown in theaccompanying drawings, it is to be understood that such embodiments aremerely illustrative and not restrictive of the current invention, andthat this invention is not restricted to the specific constructions andarrangements shown and described since modifications may occur to thoseordinarily skilled in the art.

1. A die carrier, comprising: a carrier base support component having afirst width; a carrier substrate on the carrier base support component,the carrier substrate dimensioned to fit within a TSOP socket, thecarrier substrate having a second width so that left and right portionsof the carrier substrate extend beyond the carrier base supportcomponent; a carrier body on the carrier substrate, the carrier bodyhaving a retaining formation to temporarily and removably receive amicroelectronic die; a plurality of die contacts within the retainingformation on the carrier substrate to make contact with respective onesof a plurality of terminals on the die; and a plurality of carriercontacts on at least one surface of each of the left and right portionsof the carrier substrate, the carrier contacts being electricallyconnected to the die contacts.
 2. The die carrier of claim 1, whereinthe left and right portions of the carrier substrate are between 135 and155 microns thick.
 3. The die carrier of claim 1, further comprising: acompliant component that allows for movement of the die contactsrelative to the carrier base support component.
 4. The die carrier ofclaim 1, having a suction hole through the carrier substrate and thecarrier base support component.
 5. A die carrier, comprising: a carrierbase support component; a carrier substrate on the carrier base supportcomponent; a carrier hinge base on the carrier base support component; acarrier body on the carrier substrate, having a retaining formation totemporarily and removably receive a microelectronic die; a carrier hingecomponent; and a carrier hinge pin inserted through openings in thecarrier hinge base and the carrier body to secure the carrier body tothe carrier hinge base, and through an opening in the carrier hingecomponent to secure the carrier hinge component pivotably to the carrierhinge base.
 6. The die carrier of claim 5, wherein the carrier hingecomponent is a carrier cover pivotably moveable between an open positionwherein the die is insertable into or removable from the retainingformation, and a closed position wherein the carrier cover holds the diewithin the retaining formation.
 7. The die carrier of claim 5, furthercomprising: a plurality of die contacts within the retaining formationon the carrier substrate to make contact with respective ones of aplurality of terminals on the die; and a plurality of carrier contactslocated externally of the retaining formation on the carrier substrate,the carrier contacts being electrically connected to the die contacts.8. A die carrier, comprising: a carrier substrate dimensioned to fitwithin a TSOP socket; a carrier body on the carrier substrate, having aretaining formation to temporarily and removably receive amicroelectronic die; a plurality of die contacts in the retainingformation on an upper side of the carrier substrate to make contact withrespective ones of a plurality of terminals on the die; and a pluralityof lower carrier contacts on lower sides of left and right portions ofthe carrier substrate extending beyond the carrier body, the lowercarrier contacts being electrically connected to at least some of thedie contacts.
 9. The die carrier of claim 8, further comprising: aplurality of upper carrier contacts on upper sides of the left and rightportions of the carrier substrate, the upper carrier contacts beingelectrically connected to at least some of the die contacts.
 10. A diecarrier, comprising: a carrier body having a retaining formation totemporarily and removably receive a microelectronic die; a plurality ofdie contacts in the retaining formation and positioned to make contactwith respective ones of a plurality of terminals on the die; andportions extending to the left and the right of the carrier body, eachportion having upper and lower surfaces, at least one of the upper andlower surfaces being at least partially formed by a plurality of carriercontacts that are electrically connected to respective ones of the diecontacts, wherein a vertical height between the upper and lower surfacesof a respective portion is between 135 and 155 microns, and wherein theportions extending to the left and the right of the carrier body aredimensioned to fit within a TSOP socket.
 11. The die carrier of claim10, wherein the carrier body and the portions extending to the left andthe right of the carrier body, together, have a width of between 9 and13 mm, a length of between 18 and 24 mm, and there are between 22 and 35carrier contacts on a particular portion extending to the left or theright of the carrier body.
 12. The die carrier of claim 11, wherein thevertical height is approximately 145 microns, the width is approximately12 mm, and the length is approximately 21 mm.
 13. The die carrier ofclaim 12, wherein there are 27 carrier contacts on a particular portionextending to the left or the right of the carrier body.
 14. The diecarrier of claim 12, wherein there are 33 carrier contacts on aparticular portion extending to the left or the right of the carrierbody.